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Repair of Defect Holes in EBP Masks

IP.com Disclosure Number: IPCOM000034241D
Original Publication Date: 1989-Jan-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Haug, W Kreuter, V Macdonald, SC Pietsch, D Tam, AC Zapka, W [+details]

Abstract

Defect or surplus holes in EBP (Electron Beam Proximity Printing) masks are repaired by covering the holes with an unsupported appropriately shaped film of silylated photoresist. Silylation of the patterned resist provides a hard covering material which is essential for the routine cleaning of EBP masks by excimer laser radiation. Another advantage of this method is the short time required for mask repair which can be effected in the EBP tool itself. The method described below permits the repair of defect holes 2 in an EBP mask (Fig. 1). Initially, the defective mask 1, consisting of a silicon membrane 3 with a hole pattern 4 and defect holes 2, is covered with a spin-on resist layer 5 containing reactive functional groups and spanning the holes and defects in the mask membrane (Fig. 2A).