Integrated Circuit Package
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
A method is described to provide a hybrid package for high gate current integrated circuits (ICs) with a high number of I/O drivers. This enables the best features of Tape Automated Bonding (TAB) and IBM C4 bonding processes. To solve the problems of attaching high gate count ICs to a second level package, a combination of the two techniques, C4 and TAB, is employed. The first step in the process is to connect the chip to a small piece of ceramic via C4 bonding, as shown in Fig. 1. Next a TAB tape is thermo-compression bonded to the I/O pads, as shown in Fig. 2. To attach to the card, a solder reflow operation is used. Other attachment processes are possible including conductive adhesives for the ceramic and TAB, or conductive adhesive for ceramic and thermo- compression for TAB. Now pads 1 and 2, shown in Fig.