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Formed-In-Place Solder Preform Process

IP.com Disclosure Number: IPCOM000034313D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Emmerick, AJ McAskill, RD Veasaw, JA Wolff, CW [+details]

Abstract

Herein shown and described is an improved solder preform process providing in-place solder preforming. Known tinning processes of micro-circuit module pins using preformed solder components involve placing a drop of soldering flux at each tinning site, precisely placing a solder ball at each site and then reflowing the solder in a furnace. Also, ring-shaped solder preforms have been used, the preforms being placed over a pin and reflowed. These processes have a number of limitations, including the need for precise placement, difficulties in making and handling preforms, and the like. This process eliminates such limitations. As shown in Fig. 1, a solder ball 1 is placed on the top of a lower punch 3 in a lower die 5. (Image Omitted) Fig.