Scanning Laser Conductive Paste Removal Device
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27
A technique is described whereby conductive paste is automatically removed from multilayer ceramic substrates, as used in printed circuit fabrication, through the use of a scanning laser conductive paste removal device. In prior art, removal of excessive conductive paste, which caused electrical short circuits of adjacent patterns in printed circuit substrates, was performed manually. The concept described herein eliminates the need to manually remove the paste by using a galvanometer-controlled device to enable a laser beam to automatically remove the short. The scanning laser conductive paste removal device, as shown in the figure, is mounted in a fixed position over the substrate containing the electrical short caused by the paste. Positioning of substrate 10 takes place automatically from predetermined coordinates.