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Embedded Chip in a Multilayer Circuit Board for System Security Disclosure Number: IPCOM000034375D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

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Related People

Wittmann, EG Zarger, CA [+details]


An alternate circuit board construction/component packaging technique is shown for enhancing the physical security of proprietary semiconductor chips. Conventional circuit board construction places integrated circuit semiconductor chips in a module on the surface of a board in full view and provides access for probing. By enhancing the physical security of a component package, the value of proprietary chips and software information may be better protected. Better physical security can be achieved by embedding sensitive silicon chips within the layers of a circuit board where they are relatively immune from inspection and probing. To fabricate this alternate package, the initial several layers are constructed in the usual manner with some of the subsequent layers of laminate cut away to accommodate one or more chips.