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Depth of Cut Tape Tester Disclosure Number: IPCOM000034403D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

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Related People

Shettler, DJ [+details]


This article describes an in-line tester tool and procedure for assuring the proper depth of dicing saw cut when dicing semiconductor wafers into chips. Wafers are held during the dicing process by attachment to an adhesive tape (film) frame which acts to retain diced chips until they are individually separated ("picked") from the film surface in a follow on "picking" operation. The depth of saw cut permitted in the tape frame is very critical since, if the cut is too deep, the tape frame will tear during the "picking" operation with consequent impact on wafer yield. The drawing shows the depth of cut tape tester tool. The diced tape 1 is shown attached to the tape frame 2 without a wafer, i.e., a blank tape frame. The raised rounded dowel pin 3 simulates chip picking pressure experienced by the tape frame over it.