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Auto-Defect Detection/Visual Defect Review Inspection System

IP.com Disclosure Number: IPCOM000034411D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Khoury, HA Moore, RD [+details]

Abstract

A proposal suggests a defect review inspection system for semiconductor wafers which incorporates a manual defect station along with an automatic defect detection tool. When a defect is found by the automatic system, the wafer is sent to a review station along with computer input to automatically position the defect in the review tool. Using this cheaper tool frees the expensive detection tool from the time-consuming review process. In the proposed system, each product wafer to be inspected flows through an automatic machine defect detection tool 1 in the figure. The tool detects submicron defects and provides the coordinates of that event. These are transmitted to and stored in the host supported Factory Control Monitoring System (FCMS) stand-alone interface 2.