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Flux Applicator System for Substrates

IP.com Disclosure Number: IPCOM000034424D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Sullivan, JL [+details]

Abstract

A technique is described whereby a flux applicator provides even distribution of flux to substrates by accurately dispensing the flux without making contact with the substrate. Two methods of applying the concept are discussed, one by means of an atomizer spray and the other by means of a slide containing a hole pattern. In prior art, contact fluxing of substrates, as used in the fabrication of circuits, caused uneven distribution of flux. This unevenness was caused by the surface tension of the flux adhering to the applicator as the applicator was pulled away from the surface being fluxed. The two methods described herein implement a flux applicator system to dispense the flux evenly and accurately over the entire surface area. Two concepts of non-contact fluxing are described.