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Hot-Gas Pin Repair With Pin-Side Bias

IP.com Disclosure Number: IPCOM000034427D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Puttlitz, KJ Schink, K [+details]

Abstract

A pin rework method has been developed for substrates which makes it possible to repair pins without subjecting the substrate to thermal shock. The method uses a hot-gas pin removal technique as part of a mechanical or vacuum system. It is possible to individually rework or replace pins without creating an undesirable temperature gradient. (Image Omitted) The proposal suggests two general designs, one with a mechanical pin gripper 1, as shown in Fig. 1A and one with a vacuum gripper 2 as shown in Fig. 2A. Both tools have an internal heat source 3, 4, as shown in Fig. 1A and Fig. 2A, respectively. The key feature of each is the external heat source whose operational parameters are completely independent from the internal source. In the mechanical tool, as shown in Fig.