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Piston Cooling for Micro-Circuit Modules Disclosure Number: IPCOM000034463D
Original Publication Date: 1989-Feb-01
Included in the Prior Art Database: 2005-Jan-27

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Carden, TF Cutting, LR Engle, SR Moore, RJ Williams, WF [+details]


The arrangements shown and described herein are improved piston-cooling arrangements for micro-circuit modules employing pistons as a portion of the cooling apparatus. Referring to Fig. 1, a heat sink or thermal cap 10 has a well or pocket 11 provided therein into which is fitted a piston 12 of suitable metal having a high degree of thermal conductivity. Appropriate clearances are provided for the piston to move within the confines of the well. A compression spring 13 is provided which is seated in the bottom of the well and exerts an outward force on the piston 12. The micro-circuit module or chip 15 is coupled to the piston 12 by a layer of suitable thermal grease 16, which grease is also provided in the radial space between the piston 12 and the side walls of the well 11. Fig.