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Assembly Technique for Placing Electronic Components on Printed Circuit Wiring Patterns

IP.com Disclosure Number: IPCOM000034565D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Brennemann, AE Musits, B Sasson, E Tsai, R [+details]

Abstract

This article describes an automated electronic assembly system for accurately placing surface mount components (SMCs) on printed circuit board wiring patterns. The system can accommodate a large variety of components including bottom lead SMCs. Surface mount technology (SMT) is being used in electronic circuit assemblies as the integrated circuit module. Now the surface mount component, can perform more functions. This results in an increase in the number of input-output (I/O) connections or leads needed to access the SMC. The demands on automated system accuracy for circuit assembly becomes more severe as the spacing between the I/O leads becomes smaller. Commercially available state of the art SMCs have I/O lead (Image Omitted) spacings from 20 to 50 mils (0.020 to 0.050 inch).