Browse Prior Art Database

High-Performance Processor

IP.com Disclosure Number: IPCOM000034566D
Original Publication Date: 1989-Mar-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Klink, E Najmann, K [+details]

Abstract

For obtaining short electrical signal transmission lines between the individual semiconductor chips of a processor, a logic or memory chip is used to connect the chip and the wiring carrier. Fig. 1 shows that the wiring technology employed comprises only solder ball connections 7. The critical paths of the processor are considerably reduced. Through an opening of chip carrier 3 and by paste 4, the rear side of chip 1 is thermally connected to cooling plate 5. Thus, chips 1 and 2 can be ideally cooled from their rear side.