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Monolithic Ceramic Substrate and Heat Sink for Integrated Circuit Packages

IP.com Disclosure Number: IPCOM000034685D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Powell, DO [+details]

Abstract

A ceramic integrated circuit module having greatly enhanced heat dissipating powers is described in the following. Fig. 1 shows a schematic cross section of a typical embodiment of the module. Pins 1 are located on a 0.050-inch grid 1.3 inches square to accommodate 400 I/Os for a chip of approximately 0.5 inches square. The ceramic substrate is designed with an integrated heatsink. The ceramic used is either aluminum nitride (AlN) or silicon carbide (SiC). These materials have the advantages of high thermal conductivity and thermal expansions closely matched to that of silicon. The substrate is produced by injection (or other) molding, dry pressing, green state machining, or other known ceramic forming methods.