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Chip Removal Method Disclosure Number: IPCOM000034756D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-27

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Related People

Gruber, HW Kohler, HK Najmann, K Stadler, EE [+details]


Substrates comprising several chips are repaired by removing defective chips. This can be done in two ways. 1. The chip is severed by simple reciprocal rotational movements. 2. The chip-to-substrate solder interface is preheated across the entire substrate face and then more strongly through the chip by a focusing lamp. After the solder melting point has been reached, the chip is lifted off by a suction means. The disadvantage of these methods is that the sudden chip acceleration causes the molten solder to be spilled over the chip surface, so that it can either not be analyzed or be analyzed only with great difficulty.