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Tcm-Like Circuit Module With Local Heat Sink Resting on Chip and Chip Separated From Coolant by Bellows With Pins and Deflector Plate Attached to Local Heat Sink and Extending Above Bellows Into Region of Coolant Flow Disclosure Number: IPCOM000034793D
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue


Related People

Gallagher, RM Galyon, GT Singh, P Zumbrunnen, ML [+details]


A circuit module called a thermal conduction module (TCM) has a planar array of semiconductor chips, an enclosure for the chips, a separate enclosure that carries chilled water, and metal pistons that carry heat from the chips to the water by conduction. The chip enclosure is filled with a material to improve heat transfer, for example, helium or mineral oil. In some TCM-like modules, the heat conduction function of the pistons is performed by a metal plug or stud that rests on a chip, and a bellows is attached to the plug and forms part of a separator between the chip enclosure and the water enclosure. The bellows permits the plug to adjust to the height of the chip above the substrate and to any tilt in the chip. In some modules, the metal element extends above the top of the bellows and into the stream of chilled water.