Thermal and Acoustic Probes for Copper/Ceramic Connectivity
Original Publication Date: 1989-Apr-01
Included in the Prior Art Database: 2005-Jan-27
A technique is described whereby thermal and acoustic probes are used to non-destructively test the delamination of copper at the via walls of glass ceramic semiconductor integrated circuit packages. In prior art, destructive testing was required to determine the existance of a gap at the via walls, specifically between the glass ceramic package and the copper, as shown in Fig. 1. The concept described herein utilizes thermal and acoustic probes so as to eliminate the need to destroy the package during analysis and speeds up the testing process. A pulsed or chopped laser source is used to heat the ceramic near the location of the via, as shown in Fig. 2. Using a thermal probe, the temperature of the copper is recorded.