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Circuit Module Cooling With Multiple Pistons Contacting a Heat Spreader/Electrical Buffer Plate in Contact With Chip

IP.com Disclosure Number: IPCOM000034855D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Chu, RC Edwards, DL Zumbrunnen, ML [+details]

Abstract

Some multichip circuit modules achieve high thermal performance by using metal conductors in contact with a chip to conduct the heat away. For example, a Thermal Conduction Module (TCM) has an aluminum hat with cylindrical holes containing aluminum pistons in contact with chips on a substrate. Improved heat transfer can be realized by using a multiplicity of pistons per chip which increases the heat transfer area between the pistons and the hat and thereby reduces the thermal resistance. To transfer the heat, each piston must contact part of the chip which typically means no pistons are located between chips. The heat transfer structure must be electrically isolating from the chips. Aluminum materials can be anodized for isolation whereas better conducting metals (e.g., copper) cannot. Fig. 1 is a top view and Fig.