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Circuit Module With Multi-Part Piston Located in a Channel of a Heat Sink With Wedge Mechanism for Expanding the Piston Against the Sides of the Channel

IP.com Disclosure Number: IPCOM000034858D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Agonafer, D Eid, JC [+details]

Abstract

Some circuit modules have a flat dielectric structure that carries an array of semiconductor chips on its upper surface and has internal wiring that interconnects the chips. A structure called a hat is attached to the chip carrier and forms the top of an enclosure for the chips. A structure called a piston is slidably located in a hole in the hat and contacts a chip for conducting heat in the hat. The hat is water-cooled. In this module, the lower surface of the hat has grooves that run along rows of chips where piston holes would otherwise be located. As seen in section, the grooves have a trapezoid shape with the opening wider than the roof of the channel and with sidewalls slanting di agonally outward from the roof to the opening. A multi-part piston is square as seen from the top.