Browse Prior Art Database

Circuit Package With Circulating Boiling Liquid and Local Heat Exchanger to Limit Vapor in Coolant Outlet

IP.com Disclosure Number: IPCOM000034870D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Chu, RC Simons, RE [+details]

Abstract

A circuit package has a chip carrier, an array of chips mounted on the carrier, a metal heat sink for each chip, and a barrier that carries the heat sinks and cooperates with the chip carrier to form an enclosure for the chips. An upper structure cooperates with the barrier to form an enclosure for a liquid coolant that receives heat from parts of the heat sinks that extend through the barrier. These components are conventional as broadly described. The upper structure has an inlet and an outlet for the coolant, and the coolant is circulated through an external heat exchanger. The circuit package is mounted with the chip carrier in a vertical plane, and the liquid coolant flows upwardly through the enclosure for the coolant.