Browse Prior Art Database

Water-Cooled Circuit Module With Grooves Forming Water Passages Near Heat-Producing Devices

IP.com Disclosure Number: IPCOM000034875D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Eid, JC Okonski, JE [+details]

Abstract

Some circuit modules have a flat dielectric structure that carries an array of semiconductor chips on its upper surface and has internal wiring that interconnects the chips. A structure called a hat is attached to the chip carrier and forms the top of an enclosure for the chips. A structure called a piston is slidably located in a hole in the hat and contacts a chip for conducting heat to the hat. The hat is water-cooled. In this module, grooves are cut in the top of the hat between rows of piston holes. The hat is thin and the grooves are wide so that there is only a short thermal path through the flat roof of the piston hole and the cylindrical sides of the piston hole. A cover plate fits over the top of the hat to form an enclosure for water that circulates over the top of the hat.