Thermal Conduction Module With Cross-Shaped Pistons Arranged in Interwoven Pattern for Increased Surface Area and Improved Thermal Transfer Between Pistons and Hat
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27
A known thermal conduction module (TCM) has a hat that carries pistons that contact semiconductor chips and carry heat from the chips into the hat structure via the piston. In an arbitrary orientation, the chips are positioned in a horizontal plane and the hat is positioned above the chips. Commonly, the pistons are cylindrical and bit into downwardly, opening cylindrical holes in the hat. Heat transfer from piston to hat is improved with increasing contact surface area between the piston and hat, and it has been proposed to provide fins that extend radially from a piston into vertical slots formed in the hat [*]. In this module, a piston is made in the shape of a cross with four rectangular legs perpendicular to one another.