Browse Prior Art Database

Air-Cooled Circuit Package With Fins Interfitting Between Closely Spaced Circuit Boards

IP.com Disclosure Number: IPCOM000034900D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Myers, VH [+details]

Abstract

In some circuit packages, a circuit board carries wiring to a series of electrical connectors, and circuit cards are plugged into the connectors. The package will be described with the board arbitrarily oriented in a horizontal plane and the cards on the upper surface. The cards are spaced apart on the board, parallel to each other and extending upward from the board. The cards carry components on both sides, and a thin flat metal cap is mounted on each side to enclose the components. The components produce heat which is transferred to the metal cap by conduction or convection and the cap is cooled by air. For improved cooling, a finned metal plate is attached to the outer flat surface of each cap. The plate is as wide as the cap and extends above the upper edge of the card for a suitable distance.