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Pin-Plate Heat Transfer Structure for Circuit Module

IP.com Disclosure Number: IPCOM000034905D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Agonafer, D Eid, JC [+details]

Abstract

In some circuit modules, a metal plate contacts the upper surface of a semiconductor chip and conducts heat from the chip. An array of pins contact the upper surface of the plate and transfer heat from the plate to the air or to a liquid that the module is immersed in or to a metal structure called a hat that is water-cooled. As seen from the top, the plate is larger than the chip and the edges of the plate overhang the edges of the chip. In a manufacturing process for this structure, the plate is made of aluminum and is anodized to provide a layer of insulation. The pins are then positioned on the plate and an encapsulating block of zinc is cast around the sides and upper surface of the plate and the adjacent ends of the pins.