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Tape Automated Bonding Instrumentation Technique

IP.com Disclosure Number: IPCOM000034927D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-27

Publishing Venue

IBM

Related People

Authors:
Bosley, R Lumbra, DD Phelps, DW [+details]

Abstract

A tape automated bonding (TAB) instrumentation technique is shown allowing a heat sensor to be utilized to control the heat generated by a chip. Some special cards are fabricated utilizing chips mounted on tapes (TAB assemblies) and subsequently the tape is trimmed and mounted directly on a substrate (card) ready for insertion into a circuit board. When this integrated circuit mounting technique is used, the chip is vulnerable because it is oriented in a face-up position without the protection of a metal cover. To protect the chip, an uncured epoxy is encapsulated between the face of the chip and the mounting tape during fabrication. After mounting the tape assembly on a card, the epoxy is cured in place by internally generated heat from the chip.