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Placement Probe for Fluxless Application Disclosure Number: IPCOM000035025D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-28

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Chirico, C Davies, PJ Gasper, A Morgado, EJ Perlini, JJ Polkowski, E [+details]


This article describes a probe device for placement of chips and capacitors on substrates without the aid of flux in the soldering process. Flux has traditionally been used not only to facilitate solder flow, but also to hold components, such as chips and capacitors in place on substrates during placement. However, there is a drawback with this, as flux residue stains the substrate and the placement site during the joining process, thus a cleaning operation is required after joining. Standard placement procedure entails the picking of a chip or capacitor with a probe, orienting the component and holding it in position on the probe by pulling a vacuum through the probe. After the probe and placement site are aligned, the probe places the component on the site.