Browse Prior Art Database

Thermally-Enhanced High Performance Module

IP.com Disclosure Number: IPCOM000035042D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Anderson, CL Drotar, JL Funari, J McBride, DG Smey, SL [+details]

Abstract

A method for manufacturing a multilayer, thin film package containing a heat sink compound and multiple chips using microsurface welding to join a number of thin film circuits is described. Multilayer packaging offers greater performance advantages over discrete single layer packages in that electrical paths are shortened improving the response times of these circuits. One example of such a package is known as a Metallized Ceramic Polyimide (MCP) - having one layer of polyimide. This package depends on sequential processing where the overall yield is obtained by multiplying the individual yields together, resulting in low final yields. Below is described a parallel process which allows for fabricating and testing individual layers before they are joined together.