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Closed-Loop Surface Mount Device Imaging System Disclosure Number: IPCOM000035052D
Original Publication Date: 1989-May-01
Included in the Prior Art Database: 2005-Jan-28

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Bleau, CD Gagliardi, ND Gasper, A McPherson, MC Wattenbarger, HE [+details]


This article describes an imaging system for alignment of surface mount component (SMC) leads/pads to printed circuit board or glass substrate lands utilizing a borescope to reduce optical complexity. The imaging system disclosed herein provides a means for accomplishing high accuracy closed-loop alignment of surface mount component leads and printed circuit lands prior to placement. Fig. 1 is a side view of the apparatus utilized in a robotic end-of-arm tooling. In operation a vacuum pickup head 1 picks a SMC 2 from a feed device (not shown). The robot moves the SMC to a preprogrammed location roughly over the placement site 3.