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Self-Loaded Plates for Chip Cooling

IP.com Disclosure Number: IPCOM000035135D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Kok, P Lipschutz, LD [+details]

Abstract

This article proposes the use of integral spring-loaded plates to provide a conduction path for cooling of semiconductor chips. The plates provide a low resistance thermal path from the back of a chip to the hat which seals the chip; the springs compensate for chip tilt.