Burn-In Methodology for TAB Using Separate Signal Carrier Tape
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
Disclosed is a method for burning-in chips on continuous sections of Tape Automated Bonding (TAB) tape. Individual TAB frames do not have to be handled. Operations are less labor-intensive because more automated handling can be used. A second "bus" tape provides parallel connection chips on individual TAB frames to electrical signals from a tester/exerciser. Thermocompression bonds between leads on both tapes provide the connection method.