In-Situ Sheet Resistance Sensor for Thin Film Head Lapping
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28
The final height dimension of the active sensor stripe in MR heads controls several important performance parameters. In current practice, the height is controlled by lapping the head surface until a predetermined target resistance is reached on an Electrical Lapping Guide (ELG). Because of the complex shape of the MR elements, the target resistance is found by combining the pattern dimensions with a film sheet resistance measurement made at the wafer level immediately after deposition.