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Method of Backsealing a Module Without Encapsulation of Pins

IP.com Disclosure Number: IPCOM000035258D
Original Publication Date: 1989-Jun-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Funari, J McAskill, R Roody, AG Smey, SL [+details]

Abstract

Whenever a module contains "C"-shaped pins on the sealing surface, any effort to seal that layer, i.e., surface, with the sealing epoxy, particularly SCOTCHCAST*, resulted in the pins becoming embedded in the epoxy, thereby reducing the compliancy of these pins. This encapsulation of the "C"-shaped pins is caused by the capillary action of the Scotchcast on the pins. Anytime the epoxy touches a pin, by capillary action, it moves up and over the pin like a "wick".