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This article describes a modular design for packaging a personal computer product which alleviates problems of heat escape, EMC shielding, adding features and models, and manufacturing. (Image Omitted)
English (United States)
This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately
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Alternative Packaging for a Personal Computer
This article describes a modular design for packaging a personal computer
product which alleviates problems of heat escape, EMC shielding, adding
features and models, and manufacturing.
Referring to the drawings, Fig. 1 shows the composite package of this
disclosure. It is divided into four basic subsystems; power, cards, direct access
storage device (DASD) and fan. Each subsystem is separate and is able to be
stacked. As an example, if an additional DASD was needed, it would be plugged
into the stack on top of the existing DASD. Cables to external I/O,
communications, and power would exit via the bottom of the stack. Due to the
shape of the product the heat would normally rise and exit at the top of the unit.
Fig. 2 is a bottom view of the power subsystem. Air flow would exit the product
at the power subsystem because this is the source of most of the heat in the
product. The power bus runs up through the center of the product. The CPU is
on a card which plugs into a common bus that runs up through the center of the
product. Existing attachment cards could be used and would be plugged into the
bus. The bus itself would be made in an octagon or similar shape which would
allow several cards to be plugged into it. Fig. 3 is a perspective view of the
DASD subsystem. DASD would consist of the 3.5" size with built-in controllers.
If more drives are wanted, then an additional DASD subsystem could be stacked