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TAB Tape Structure for Area Array TAB Disclosure Number: IPCOM000035408D
Original Publication Date: 1989-Jul-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue


Related People

Kovac, CA Palmer, MJ Vilkelis, WV [+details]


Disclosed is a novel structure for TAB tape and outer lead bonding which maintains the advantages of the TAB inner lead thermocompression bond, yet allows direct access to the card grid. The disclosure allows outer lead bonding of TAB packages to fan out to the via grid of the printed circuit card using the TAB structure to replicate the method of attaching PGA structures to cards. This method removes the wiring congestion associated with wiring fan out within a printed circuit card by placing the fan out on the TAB package. The result is an improvement in the wireability of large I/O TAB packages. (Image Omitted)