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Array Manifolds for Multi-Chip-Module Cooling Systems Disclosure Number: IPCOM000035754D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

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Flint, EB Mok, LS [+details]


The array manifold described here provides parallel paths to distribute and collect coolant from each chip on a multi-chip module. The coolant flow-rate of each chip can be adjusted independently according to the chip power and its operating temperature.