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Electroless Plating for Low-Cost High-Leverage Wiring

IP.com Disclosure Number: IPCOM000035814D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Cote, WJ Cronin, JE [+details]

Abstract

When conductor patterns are defined by etching troughs into insulators and filling the troughs with a conductor, the resulting vias to underlying conductors and troughs present a gapfill problem when their depth-to-width aspect ratios are greater than or equal to one. This article discloses a method that solves the gapfill problem.