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Electroless Plating for Low-Cost High-Leverage Wiring Disclosure Number: IPCOM000035814D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

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Cote, WJ Cronin, JE [+details]


When conductor patterns are defined by etching troughs into insulators and filling the troughs with a conductor, the resulting vias to underlying conductors and troughs present a gapfill problem when their depth-to-width aspect ratios are greater than or equal to one. This article discloses a method that solves the gapfill problem.