Electroless Plating for Low-Cost High-Leverage Wiring
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
When conductor patterns are defined by etching troughs into insulators and filling the troughs with a conductor, the resulting vias to underlying conductors and troughs present a gapfill problem when their depth-to-width aspect ratios are greater than or equal to one. This article discloses a method that solves the gapfill problem.