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Process for Forming Copper Clad Vias

IP.com Disclosure Number: IPCOM000035821D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Christiansen, RA Leslie, GG Williams, GR [+details]

Abstract

One of the requirements of many printed circuit boards is a conductive layer of material on both faces which must be electrically connected through vias. Conventional copper plating of the vias is a technique for providing such connection, but presents some manufacturing problems.