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Process for Direct Printing of High-Resolution Metal Patterns

IP.com Disclosure Number: IPCOM000035865D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Acocella, J Acosta, RE Bassous, E Benenati, JA Shepard, JF Speidell, JL [+details]

Abstract

A process is described for generating high-resolution metallization patterns on insulating and conducting materials which is applicable to the fabrication of microelectronic device structures. It is particularly useful in depositing circuit metallurgy on glass, ceramic, polymer and composite dielectric layers for first and second level packaging applications.