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The decal shown in Fig. 1 can be modified to allow it to be bonded by the Tape Automated Bonding (TAB) thermode technique. Two proposed designs are described as follows: (Image Omitted)
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Decal Enhancements for Tape Automated Bonding
The decal shown in Fig. 1 can be modified to allow it to be bonded by the
Tape Automated Bonding (TAB) thermode technique. Two proposed designs are
described as follows:
1. The design shown in Fig. 2 can be achieved by etching a window in the
polyimide film to expose the metal outer leads. The decal will then be gang-
bonded directly onto the board, as shown in Fig. 3.
2. The design shown in Fig. 4 can be achieved with the addition of a stiffener
on the polyimide. The stiffener will hold the polyimide film tightly to provide
support for the leads during the excise step. The decal will then be gang-bonded
to the board by heating through the polyimide film as shown in Fig. 5.
The designs described above will also eliminate the need for a stress relieve
cycle after the decal is bonded.
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