Masking Critical Areas During Metalization Using Polyethylene Thick Films
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
During evaporative deposition of metal it is sometimes necessary to cover portions of the substrate or module to prevent deposition of covered areas. This is done typically using fabricated shadow-masks and covers or by taping. Those methods expose the work to the risk of abrasive damage or adhesive residue.