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Masking Critical Areas During Metalization Using Polyethylene Thick Films

IP.com Disclosure Number: IPCOM000035883D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Kendall, RA [+details]

Abstract

During evaporative deposition of metal it is sometimes necessary to cover portions of the substrate or module to prevent deposition of covered areas. This is done typically using fabricated shadow-masks and covers or by taping. Those methods expose the work to the risk of abrasive damage or adhesive residue.