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Solder Bump-Making Process

IP.com Disclosure Number: IPCOM000035888D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Arimoto, Y [+details]

Abstract

This process is used to deposit solder bumps on a printed circuit board. The board with solder bumps is to be used as a carrier for the DCA (Direct Chip Attach) application, as shown in Fig. 1. The following is a specific example of the process.