Browse Prior Art Database

Solder Bump-Making Process Disclosure Number: IPCOM000035888D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue


Related People

Arimoto, Y [+details]


This process is used to deposit solder bumps on a printed circuit board. The board with solder bumps is to be used as a carrier for the DCA (Direct Chip Attach) application, as shown in Fig. 1. The following is a specific example of the process.