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Biasing Means for Contactless Laser Inspection Testing of Circuit Packages

IP.com Disclosure Number: IPCOM000035911D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Beha, H Clauberg, R Rubloff, GW Liehr, M [+details]

Abstract

A technique is described whereby limitations of laser photoemission testing of wiring are removed by contacting and properly biasing the wiring to be tested. By contacting and biasing the wiring, using techniques such as metal-clad flexible sheeting, problems associated with wire charging and materials variations are removed, for laser photoemission inspection testing of the wired packages.