Biasing Means for Contactless Laser Inspection Testing of Circuit Packages
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
A technique is described whereby limitations of laser photoemission testing of wiring are removed by contacting and properly biasing the wiring to be tested. By contacting and biasing the wiring, using techniques such as metal-clad flexible sheeting, problems associated with wire charging and materials variations are removed, for laser photoemission inspection testing of the wired packages.