Use of Plasma Modification to Increase Polymer Adhesion to Oxygen Etch Barriers
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28
In thin film redistribution (TFR) and similar operations polymer adhesion to oxygen etch barriers is poor. An annealing process has been invented which increases polyimide (PI) T-O adhesion by 500% as compared to PMDA-ODA (pyromalidic dianhydride-octyldecyl amine) adhesion to the virgin hexamethyldisilazane [HMDS(N)] surface. The development involves annealing the HMDS(N) film at 400oC/2 hrs. in air and treating that surface with argon (Ar) and ammonia (NH3) plasmas using a molybdenum (Mo) plate-covered cathode.