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Metal Frame for Passive Super Chip Module

IP.com Disclosure Number: IPCOM000035969D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Gruber, HW Hinrichsmeyer, K Stadler, EE Kohler, H [+details]

Abstract

A metal frame is described which provides three functions in conjunction with the passive super chip (PSC) module. 1. It is used to position the PSC on the signal plane of the module pin plate. 2. It is used to mechanically hold down the PSC on the spacer and the signal plane to prevent vibration and floating prior to and during wire bonding. 3. It is used to ground the PSC.