Browse Prior Art Database

TCM With Multiple Side-Loaded Interlocking Pistons for Improved Thermal Resistance

IP.com Disclosure Number: IPCOM000036009D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Edwards, DL Zumbrunnen, ML [+details]

Abstract

Disclosed is a method of achieving a low internal thermal resistance in a TCM without tight tolerances by using a multiple piston conduction cooling scheme where four interlocking pistons in a common hole contact the back of the chip. The chip-to-pistons thermal resistance is low because of near 100% chip coverage, flat piston faces, and multiple contacts, preventing a single piece of contamination from disrupting the entire chip thermal interface. The interlocking design eliminates the need for piston headers, resulting in the hat being closer to the chip, thereby shortening the thermal path to the cooling water. The piston-to-hat thermal resistance is low because of side loading between pistons and because of the increased surface area inherent with multiple pistons.