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TCM Encapsulation Springs That Minimize the Effects of Contamination Particles on Thermal Contact Resistance Disclosure Number: IPCOM000036011D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

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Related People

Edwards, DL Zumbrunnen, ML [+details]


Contamination particles at the chip-to-cooling-hardware interface are the major contributor to the uncertainty of the interface's range of thermal resistance. Particles which are large enough to disrupt the interface can, with this invention, be crushed and/or imbedded into the cooling hardware because of large forces present during hardware encapsulation. This will result in a consistently smaller mean spacing at the chip-to-cooling-hardware interface, and therefore a smaller range of contact resistances. A Shape Memory Alloy (SMA) spring provides a means by which the large force at the chip-to-cooling-insert interface can occur during cooling-hardware encapsulation and then subsequently reduced to a force adequate to maintain thermal contact.