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Process for Producing Lateral Chip Connectors Disclosure Number: IPCOM000036031D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

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Euen, W Keinert, J [+details]


To reduce the space requirements of semiconductor chips, it is proposed that the chips be stacked and laterally connected to each other. For this purpose, several (say, identical storage) chips 1 are provided with an insulation layer 2 and planarized.