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Process for Producing Lateral Chip Connectors

IP.com Disclosure Number: IPCOM000036031D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Euen, W Keinert, J [+details]

Abstract

To reduce the space requirements of semiconductor chips, it is proposed that the chips be stacked and laterally connected to each other. For this purpose, several (say, identical storage) chips 1 are provided with an insulation layer 2 and planarized.