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Thermal Conduction Module With Integral Cold Plate Formed by a Cover Plate and a Seal

IP.com Disclosure Number: IPCOM000036046D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Hwang, UP Ing, PW [+details]

Abstract

In a new thermal conduction module (TCM), a cold plate is formed by a top cover plate, the underlying plate of the module hat, and a seal that bridges the space between the two plates. The plates are held together by screws located outside the seal. The cover plate carries inlet and outlet fittings for connection to a supply of chilled water. The seal has a metal ring that is H shaped in section and upper and lower elastomeric rings that are each locked into a notch of the H shape and extend beyond the metal ring in a half-cylinder shape.