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Encapsulant Flow Containment Disclosure Number: IPCOM000036047D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

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Jones, AS Lamont, RM Lazenby, K [+details]


This article describes methods of preventing the uncontrolled spread of uncured fluid encapsulant when applied to circuit-chips that are wire bonded onto flexible circuits. Use is made of formers to constrain, by surface tension, the wet encapsulant from encroaching onto undesired areas of the circuit layer.