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Board-To-Board Interconnects in a Thermal Conduction Module System

IP.com Disclosure Number: IPCOM000036054D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Donner, EO Jarvela, RA [+details]

Abstract

Large computer systems using Thermal Conduction Module (TCM) packaging and cooling systems will continue to put more and more functions on individual boards. This will result in more and more interconnection and communication pathways. In some cases, it may be desirable to have one machine element communicate with another in one clock cycle or less. A solution to this problem is to provide for a direct boardto-board connection system for at least some channels. (Image Omitted)