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Heat Sink With Small-Scale Etched Pin Fins

IP.com Disclosure Number: IPCOM000036063D
Original Publication Date: 1989-Aug-01
Included in the Prior Art Database: 2005-Jan-28

Publishing Venue

IBM

Related People

Authors:
Carbone, MC Fasano, BV [+details]

Abstract

Disclosed is a process for economical fabrication of a heat sink with a dense array of small-scale pin fins. Decreasing the size and increasing the number of fins affords an advantage in the ultimate cooling density achievable. Such heat sinks will elicit high heat transfer rates when an impinging fluid flow is directed along the axis of the pins.